nichia sts-da1-2682a nichia corporation specifications for white led NSSW157BT pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-2682a 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 150 ma pulse forward current i fp 200 ma allowable reverse current i r 85 ma power dissipation p d 510 mw operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =80ma 3.0 - v luminous flux v i f =80ma 28.9 - lm luminous intensity i v i f =80ma 9.5 - cd x - i f =80ma 0.287 - - chromaticity coordinate y - i f =80ma 0.272 - - thermal resistance r js - 22 30 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts-da1-2682a 2 ranks item rank min max unit forward voltage - 2.7 3.4 v p11d21 30.3 33.0 p10d22 27.8 30.3 p10d21 25.5 27.8 luminous flux p9d22 23.3 25.5 lm color ranks rank t01 rank t02 x 0.2945 0.2915 0.2955 0.2985 x 0.2905 0.2875 0.2915 0.2945 y 0.2760 0.2910 0.2980 0.2830 y 0.2680 0.2830 0.2910 0.2760 rank t03 rank t04 x 0.2865 0.2835 0.2875 0.2905 x 0.2825 0.2795 0.2835 0.2865 y 0.2610 0.2760 0.2830 0.2680 y 0.2530 0.2680 0.2760 0.2610 rank t05 rank t06 x 0.2785 0.2755 0.2795 0.2825 x 0.2745 0.2715 0.2755 0.2785 y 0.2460 0.2610 0.2680 0.2530 y 0.2380 0.2530 0.2610 0.2460 * ranking at t s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 7% * chromaticity coordinate tolerance: 0.005 * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia.
nichia sts-da1-2682a 3 chromaticity diagram t01 t02 t03 t04 t05 t06 0.22 0.24 0.26 0.28 0.30 0.32 0.24 0.26 0.28 0.30 0.32 0.34 x y
nichia sts-da1-2682a 4 outline dimensions sts-da7-0080d nxsx157x ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) o protection device ka dimensions do not include mold flash or metal burr. ?????? * 3 (1) 1.4 (2.6) 0.52 (0.2) 0.54 1.56 2.6 0.86 (0.6) (0.3) anode cathode ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials | weight description ????` heat-resistant polymer ?`? ? + w? silicone resin (with diffuser and phosphor) ~? + y? ag-plated copper alloy 0.0073g(typ)
nichia sts-da1-2682a 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern recommended metal solder stencil aperture ( g unit: mm) 0.86 0.5 1.55 0.6 1.66 0.64 0.6 0.7 2.4 0.66 1.55 0.86 0.6 1.56 0.54 0.6 0.8 0.8 * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twic e. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temper ature gradually from th e peak temperature. * nitrogen reflow soldering is re commended. air flow soldering condit ions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delamina tion and deformation, and wire breaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. 120sec max pre-heat 180 to 200c 260c max 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-2682a 6 tape and reel dimensions sts-da7-0071b quantity per reel=5000pcs 1 `?? 5000 ? * nxxx157x ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 1.6 0.1 0.2 0.05 3.25 0.1 0.65 0.1 -0 1 +0.1 cathode
nichia sts-da1-2682a 7 packaging - tape & reel nichia led sts-da7-0006c nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ????`??????`???? desiccants ? moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`? ?`???????y?????? * ??\H?y?B???y? * ?QH??n?????u?p?????? * using the original package material or equivalent in transit is recommended. do not expose to water. the box is not water-resistant. do not drop or expose the box to extern al forces as it may damage the products. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. * u???`?????n?go??`y? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ?? ? for details, see "lot numbering code" in this document. * ??????????? the label does not have the rank field for un-ranked products. * ???????????
nichia sts-da1-2682a 8 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous flux
nichia sts-da1-2682a 9 derating characteristics nssx157x sts-da7-0094c ? no. derating1 0 50 10 0 15 0 20 0 25 0 020406080100120 (74, 150) (100, 65.0) derating2 0 50 100 150 200 250 0 20 40 60 80 100 120 (1 00, 1 50) duty 10 10 0 1000 1 1 0 100 150 200 S allowable forward current ( ma ) `??????-S solder te mpe rature(c athode side) vs allowable forward current ??-S ambient tempe rature vs allowable forward current S allowable forward current(ma) S allo wable forward current(ma) `?????? solder temperature(cathode side)(c) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a =25c 95 c/w ja r =
nichia sts-da1-2682a 10 optical characteristics nssw157x ? no. sts-da7-0848a spectrum 0.0 0.2 0.4 0.6 0.8 1.0 350 400 4 50 500 5 50 600 650 700 7 50 ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -8 0 -90 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 80ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 80 ma i fp = t a =25c
nichia sts-da1-2682a 11 forward current characteristics / temperature characteristics nssw157b sts-da7-4009 ? no. tavf 2.0 2.5 3.0 3.5 4.0 -60 -40 -2 0 0 20 40 60 80 10 0 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -2 0 0 20 40 60 80 1 00 120 vfif 10 100 10 00 2.0 2.5 3.0 3.5 4.0 80 20 0 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux for ward curren t( m a) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 50 1 00 150 200 250 relative luminous flux(a.u.) - forward current vs relative luminous flux forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp =80ma i fp = 80ma
nichia sts-da1-2682a 12 forward current characteristics / temperature characteristics ? no. nssw157b sts-da7-4010 taxy 0.25 0.26 0.27 0.28 0.29 0.27 0.28 0.29 0.30 0.31 25c 100c 0c -4 0c x ifxy 0.25 0.26 0.27 0.28 0.29 0.27 0.28 0.29 0.30 0.31 10ma 20 ma 80ma 150ma 200 ma x y y 80ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-2682a 13 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 thermal shock jeita ed-4701 300 307 -40c to 100c, 1min dwell, 10sec transfer, precondition: 30c, 70%rh, 168hr 100cycles #1 0/50 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =80ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =150ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =65ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =100ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =80ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positi ve or negative #1 0/22 soldering joint shear strength jeita ed-4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 95c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =80ma >u.s.l.1.1 #1 luminous flux( v ) i f =80ma nichia sts-da1-2682a 14 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. se e ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorptio n during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, prefer ably the original moisture -proof bags for storage. after the ?period after opening? stor age time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposu re to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect so ldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosi ve gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds might cause an open ci rcuit. silicone rubber is recommended as a material for seals. bear in mi nd, the use of silicones may lead to silico ne contamination of electrical contacts inside the products, caused by lo w molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... leds should be operated in forward bias. driving circuits must not subject leds to either forward or reverse voltage while off . continuous reverse voltage can cause migration and led damage. it is recommended to operate the leds at a current greater th an 10% of the sorting current to stabilize the led characteristic s. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (3) handling precautions do not handle leds with bare hands, it may contaminate the led surface and affect optical characteristics. in the worst case, catastrophic failure from excess pres sure through wire-bond breaks and package damage may result. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the produc t may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures.
nichia sts-da1-2682a 15 (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when design ing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w ts point (7) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning.
nichia sts-da1-2682a 16 (8) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions ha ve adopted standards based on the iec laser safety standard iec 60825-1: 20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applicat ions in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuc lear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. both the customers and nichia will agree on official specificatio ns of supplied produc ts before a customer 's volume production . specifications and appearance subject to change for improvement without notice.
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